Technology Specification

Max Panel Size

Single/Double PCB

600x1200mm

Board Thickness

0.3~3.0mm

Copper Thickness

1-4 OZ

Min Line Width/ Space

0.15/0.15mm

Min Through Hole Size

0.5mm

PTH Wall Thickness

> 0.020mm

PTH Toerance

￠≤ 0.8mm

+/-0.05mm

￠≥ 0.8mm

+/-0.08mm

Non PTH Tolerance

￠≤ 4.0mm

+/-0.05mm

￠≥ 4.0mm

+/-0.10mm

Hole Position Deviation

+/-0.08mm

Outline Tolerance

+/-0.20mm

Insulation Resistance

1012ohms(Normal)

Dielectric Strength

>1.3kv/mm

Thermal Conductivity

1-4W/m*k

Peel-off Strength

1.4N/mm

Metals Peel-off Strenght

(￠1.0mm)>50N

Solder Mask Abrasion

>5H

Thermal Stress

265℃/5Sec

Flammability

94V-0

Max Work Temperature

125℃

Bow and Twist

<0.01mm/mm

Surface Treatment

LF HAL, ENIG, Flash Gold