PCB Technology |
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Aluminum PCB |
Technology Specification |
Max Panel Size |
Single/Double PCB |
600x1200mm |
Board Thickness |
0.3~3.0mm |
Copper Thickness |
1-4 OZ |
Min Line Width/ Space |
0.15/0.15mm |
Min Through Hole Size |
0.5mm |
PTH Wall Thickness |
> 0.020mm |
PTH Toerance |
¢≤ 0.8mm |
+/-0.05mm |
¢≥ 0.8mm |
+/-0.08mm |
Non PTH Tolerance |
¢≤ 4.0mm |
+/-0.05mm |
¢≥ 4.0mm |
+/-0.10mm |
Hole Position Deviation |
+/-0.08mm |
Outline Tolerance |
+/-0.20mm |
Insulation Resistance |
1012ohms(Normal) |
Dielectric Strength |
>1.3kv/mm |
Thermal Conductivity |
1-4W/m*k |
Peel-off Strength |
1.4N/mm |
Metals Peel-off Strenght |
(¢1.0mm)>50N |
Solder Mask Abrasion |
>5H |
Thermal Stress |
265℃/5Sec |
Flammability |
94V-0 |
Max Work Temperature |
125℃ |
Bow and Twist |
<0.01mm/mm |
Surface Treatment |
LF HAL, ENIG, Flash Gold | |
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