|
Process |
SS |
DS |
MUL(4-14Layers) |
|
Laminate |
FR4,CEM-1,CEM-3 |
FR4, High Tg, High CTI, High Frequency, Halogen Free, CAF Resistance |
FR4, High Tg, High CTI, High Frequency, Halogen Free, CAF Resistance |
|
Max WP size |
510X610mm |
510x610mm |
510x610mm |
|
Finish thick |
0.4-3.2mm |
0.4-3.2mm |
0.4-3.2mm |
|
Copper |
1/2-3OZ |
1-6OZ |
1-6OZ |
|
Inner layers |
N/A |
N/A |
Min line width/spacing:4/4mil |
|
N/A |
N/A |
Min hole wall to conductor :7mil(all layers) |
|
N/A |
N/A |
Min inner core thk.0.05mm(excluding cu) |
|
Drill |
Min drill bit:0.3mm |
Min drill bit:0.25mm(normal),0.2mm(min.) |
Min drill bit:0.25mm(normal),0.2mm(min.) |
|
Min hole for punching:N/A |
Max aspect ratio(Fin board thk/fin hole size) :8:1 |
Max aspect ratio(Fin board thk/fin hole size) :8:1 |
|
Laser drill |
|
|
3-6mil |
|
Outer D/F |
Min line width spacing:4/4 mil (D/F) |
Min line width spacing:4/4 mil |
Min line width spacing:4/4 mil |
|
Min annular ring on A/W:5 mil (D/F) |
Min annular ring on A/W:4mil(>0 mil),5 mil(>/=1mil) |
Min annular ring on A/W:4mil(>0 mil),5 mil(>/=1mil) |
|
Solder mask |
Min S/M opening:1.5 mil |
Min S/M opening:1.5mil |
Min S/M opening:1.5mil |
|
Min S/M bridge:3.5 mil |
Min S/M bridge :3.3mil |
Min S/M bridge :3.3mil |
|
|
Plug via:0.6mm or less drill bit |
Plug via:0.6mm or less drill bit |
|
Surface finish |
HAL LF thk.:25-1600u” |
HAL LF thk.:25-1600u” |
HAL LF thk.:25-1600u” |
|
Immersion Au thk.(normal): 0.03-0.15um |
Immersion Au thk.(normal): 0.03-0.15um |
Immersion Au thk.(normal): 0.03-0.15um |
|
Immersion Au thk.(max.) 3u” min |
Immersion Au thk.(max.) 3u” min |
Immersion Au thk.(max.) 3u” min |
|
Immersion Ag thk. 6-18u” |
Immersion Ag thk. 6-18u” |
Immersion Ag thk. 6-18u” |
|
Immersion Tin thk. 1.0+/-0.2um |
Immersion Tin thk. 1.0+/-0.2um |
Immersion Tin thk. 1.0+/-0.2um |
|
Platin gold thk.(normal) :0.03um” |
Platin gold thk.(normal) :0.03um” |
Platin gold thk.(normal) :0.03um” |
|
Platin gold thk.(max.) :1um min |
Platin gold thk.(max.) :1um min |
Platin gold thk.(max.) :1um min |
|
Platin gold thk for gold finger(normal):0.5um min |
Platin gold thk for gold finger(normal):0.5um min |
Platin gold thk for gold finger(normal):0.5um min |
|
Platin gold thk for gold finger(max.) :1um min |
Platin gold thk for gold finger(max.) :1um min |
Platin gold thk for gold finger(max.) :1um min |
|
Profile |
Punching +/-0.1mm |
Punching +/-0.1mm |
Punching +/-0.1mm |
|
Routing +/-0.10mm |
Routing +/-0.10mm |
Routing +/-0.10mm |
|
Impedance |
Normal :OK |
Normal :OK(+/-5-10%) |
Normal :OK(+/-5-10%) |
|
Different:OK |
Different:OK(+/-10%) |
Different:OK(+/-10%) |
|
HDI |
N/A |
N/A |
1+N+1 |
|
Electrical Testing |
Voltage: 10V-250V; Max.E/T Insulation resistance: 100M Ohms; Min E/T Conductive resistance: 10 Ohms |
Voltage: 10V-250V; Max.E/T Insulation resistance: 100M Ohms; Min E/T Conductive resistance: 10 Ohms |
Voltage: 10V-250V; Max.E/T Insulation resistance: 100M Ohms; Min E/T Conductive resistance: 10 Ohms |
